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地址：深圳市南山區(qū)高新中區(qū)麻雀嶺工業(yè)區(qū)M-7棟中鋼大廈西三樓

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郵箱：sales@acroview.com

昂科燒錄器軟件_ V1.05.21(20230304)今日發(fā)布

時間：2023-03-05   訪問量：4758

Hi  All：

 

昂科軟件_ V1.05.21(20230304)今日發(fā)布，如有需要，請前往官網(wǎng)下載，鏈接:

下載鏈接（先注冊-登錄-再到軟件下載中心-下載）http://www.nuberod.com/member/login/

 

A：手動燒錄器：AP8000、AP8000F、PT100

B：ic自動燒錄機：IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200

更新芯片列表如下：


更新芯片列表如下：

                                                            V1.05.21_20230304
AcroviewProgrammer TypeItemsManufactureChip NamePackageAdapterDescription
New DevicesActionsATS2853(SPC1)QFN48(6x6)QFN48(6x6)-AG84
AdestoAT25SF641-S*BSO8(210mil)SO8(210)-AG01
AllegroA5931GESTR-TQFN24(4x4)QFN24(4x4)-AG03
AllegroA5932GESSR-1-TQFN24(4x4)QFN24(4x4)-AG06
AllegroA5932GESSR-TQFN24(4x4)QFN24(4x4)-AG06
AnalogixANX7411QFN28(4x4)QFN28(4x4)-AG20
BOSCHSMA750(ISP-PSI5)NULLISP(SPC)-S19
CypressCY91F526JSE-GSE2LQFP120(16x16)TQFP120(16x16)-AG10
EastsoftHR7P170FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHSSO20(300)SO20(300)-AG18
EastsoftHR7P201FHS3SO16(150)SO16(150)-AG12
GigaDeviceGD32FFPRTGUQFN36(6x6)QFN36(6x6)-AG01
GigaDeviceGD25LD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25LD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25WD80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25WD80EKUSON8(1.5x1.5)DFN8(1.5x1.5)-AG01
GigaDeviceGD25WD80ETSOP8(150mil)SO8(150)-AG01
GigaDeviceGD25LF80EEUSON8(3x2mm)DFN8(2x3)-AG01
GigaDeviceGD25LF80ENUSON8(3x4mm)DFN8(3x4)-AG01
GigaDeviceGD25LF80ESSOP8(208mil)SO8(210)-AG01
GigaDeviceGD32E503RCTTQFP64(10x10)TQFP64(10x10)-AG01(F)
HisiliconSD5006RNIV100(P+D)QFN40(6x6)QFN40(6x6)-S03
HisiliconSD5006RNIV101(P+D)QFN48(7x7)QFN48(7x7)-S42
HisiliconSD5006RNIV101-ICBoard(P+D)QFN42(17x20)QFN42(17x20)-S01
HisiliconSD5006RQIV103(P+D)TQFP64(10x10)TQFP64(10x10)-S43
HisiliconSD5006RQIV103-ICBoard(P+D)QFN54(20x22)QFN54(20x22)-S01
HYCONHY16F198B-L064LQFP64(10x10)TQFP64(7x7)-AG118
INDIEIND83211QFN48(6x6)QFN48(6x6)-AG76
ITEIT8857FNQFN56(6x6)QFN56(6x6)-AG09
MicrochipPIC16F1823-*/MLQFN16(4x4)QFN16(4x4)-AG01
MicrochipPIC16F1829-*/MLQFN20(4x4)QFN20(4x4)-AG01
MPSMAC1678GQNTQFN56(7x7)QFN56(7x7)-AG35
MTMicrosystemsMT6AGCS(TEST029)QFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01
NumonyxPC28F128P33BBGA64(8x10mm)BGA64(8x10)-AG01(CS)
NXPSPC5606BF1*LQTQFP144(20x20)TQFP144(20x20)-AG10
NXPFXLS93230(ISP-PSI5)NULLISP(SPC)-S19
NXPNCF29A3XHNQFN32(5x5)QFN32(5x5)-S32
NXPS9S08DZ96F2*LHTQFP64(10x10)TQFP64(10x10)-AG08
RenesasR7FA2E1A7*CFLTQFP48(7x7)TQFP48(7x7)-AG149
RICHTEKRT7807N-AQFN32(4x4)QFN32(4x4)-AG68
SanDiskSDINBDA6-256GBGA153(11.5x13)BGA153(11.5x13)-AG01
STMT6AGCS(TEST029)-STQFN16(4.8x4.8)QFN16(4.8x4.8)-AG01
STSTM32WB55*G(FUS+BLEStack+APP+Option)(ISP-SWD-3V-SPC0022)NULLISP-AG08
STSTM32F103VGTLQFP100(14x14)TQFP100(14x14)-AG07(F)(CS)
TIBQ27500QFN12(4x2.5)QFN12(4x2.5)-AG02
TITPS536C7(HEX)QFN48(6x6)QFN48(6x6)-AG46
TITMS320F28035(ISP-JTAG-3.3VTTL-3.3V)NULLJTAG(C2000)-S01
ToshibaTHGBMJG6C1LBAU7BGA153(11.5x13)BGA153(11.5x13)-AG01
YMTCYMEC7BOTE1A2C3BGA153(11.5x13)BGA153(11.5x13)-AG01
Update DevicescFeonEN25QH16B-***HSOP8(200mil)SO8(210)-AG01Update: After burning CMP, there is no way to re-burn the flash area

(Must carefully confirm config option and redo project load burning)
CypressCYPD5225-96BZXBGA96(6x6)BGA96(6x6)-S02Update: Solve the problem that some chips fail to enter mode and the data is changed after burning customer files

(Must carefully confirm config option and redo project load burning)
elmosE52417A(SPC)QFN20(5x5)QFN20(5x5)-AG04Update: To solve the problem of burning CC address data is not correct, add Secure Verify

(Must carefully confirm config option and redo project load burning)
GigaDeviceGD32F470ZGTTQFP144(20x20)TQFP144(20x20)-AG06Update: Fix stability issues and speed up

(Must carefully confirm config option and redo project load burning)
iCommSemiSV32WB01LQFN32(4x4)QFN32(4x4)-AG43Update: Solve the problem of CHECKSUM failure when customers burn SV32WB01L chip files larger than 1M

(Must carefully confirm config option and redo project load burning)
KIOXIATC58CYG1S3HRAIJWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed number of blocks and buffer range

(Must carefully confirm config option and redo project load burning)
MicrochipdsPIC33CK256MP503(SINGLE)QFN36(5x5)QFN36(5x5)-AG01Update: Solve some chip burning failure problem

(Must carefully confirm config option and redo project load burning)
MicrochipATSAME51J18A-ATQFP64(10x10)TQFP64(10x10)-AG80Update: Solve the Reserved bit does not burn no check problem

(Must carefully confirm config option and redo project load burning)
MPSMP2845BGQKQFN56(6x6)QFN56(6x6)-AG08What's New: Modified the Check ID flow and password processing flow

(Must carefully confirm config option and redo project load burning)
NationN32G435CBLTQFP48(7x7)TQFP48(7x7)-AG73Update: Resolve erasing failure and report check failure when burning

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8200A0ESQFN56(8x8)QFN56(8x8)-AG06Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC33PF8100A0ESQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPMC34PF8100A0EPQFN56(8x8)QFN56(8x8)-S05Update: Add UID read

(Must carefully confirm config option and redo project load burning)
NXPS32K314EHT1*PBMAXQFP172(16x16)MAXQFP172(16x16)-AG01Update: Solve the problem of checking failure when burning

(Must carefully confirm config option and redo project load burning)
RealtekRTL8762DKQFN48(6x6)QFN48(6x6)-S28Update: Solve the problem of unstable burning

(Must carefully confirm config option and redo project load burning)
RenesasR7F701649*AFPPQFP176(24x24)PQFP176(24x24)-4-AG29Update: Customer part of the material erasure failed

(Must carefully confirm config option and redo project load burning)
RenesasR7F701374A*AFPLQFP144TQFP144(16x16)-AG02New: Added functions of Code ID and Data ID

(Must carefully confirm config option and redo project load burning)
WinbondW25N01GWZEIGWSON8(8x6mm)VPDFN8(8x6)-AG01Update: Fixed multiple seat son erasing bad block failure

(Must carefully confirm config option and redo project load burning)
WinbondW25Q128JVSIMSOIC8(208mil)SO8(210)-AG01New: Changed the default QE value

(Must carefully confirm config option and redo project load burning)
GUI modifcationsV1.4.11(20230220) 1、取消”Intel Hex”限制，可以對所有檔案解析負(fù)偏移
Firmware modifications
MultiAprog modificationsV1.2.99(20230223) 1、多站點初始化由串行改成并行，加快啟動速度     2、新增對Bottom Board-AG07的支持


------------------Best wishes--------------------



昂科技術(shù)成立于2013年2月，2016年被認(rèn)定為國家高新企業(yè)和深圳市高新企業(yè)，并取得多項軟件著作權(quán)以及專利，昂科核心人員均擁有編程設(shè)備研發(fā)、制造以及服務(wù)領(lǐng)域十多年的豐富經(jīng)驗，具有世界領(lǐng)先技術(shù)，并致力于為客戶提供創(chuàng)新的IC編程器解決方案和產(chǎn)品。正努力為編程設(shè)備的可靠性、安全性以及知識產(chǎn)權(quán)保護方面做出杰出貢獻。昂科始終堅信對品質(zhì)與技術(shù)的追求會使越來越多的電子廠商選擇昂科作為他們值得信賴的合作伙伴，新產(chǎn)品持續(xù)在發(fā)布中，請保持關(guān)注。


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